Hennesthal, C. : rechercher sur Z-Library

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1

Copper–dielectric cap interface with enhanced reliability for 45 nm technology and beyond

J. Hohage, U. Mayer, M.U. Lehr, F. Feustel, O. Aubel, C. Hennesthal

Journal:

Microelectronic Engineering

Année:

2010

Langue:

english

Fichier:

PDF, 516 KB

english, 2010

2

Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects

Cao, Linjun, Ganesh, K. J., Zhang, Lijuan, Aubel, Oliver, Hennesthal, Christian, Hauschildt, Meike, Ferreira, Paulo J., Ho, Paul S.

Journal:

Applied Physics Letters

Année:

2013

Langue:

english

Fichier:

PDF, 1.42 MB

english, 2013

3

[IEEE 2010 IEEE International Reliability Physics Symposium - Garden Grove (Anaheim), CA, USA (2010.05.2-2010.05.6)] 2010 IEEE International Reliability Physics Symposium - Effects of cap layer and grain structure on electromigration reliability of Cu/low-k interconnects for 45 nm technology node

Zhang, L., Zhou, J. P., Im, J., Ho, P. S., Aubel, O., Hennesthal, C., Zschech, E.

Année:

2010

Langue:

english

Fichier:

PDF, 1.63 MB

english, 2010

4

[IEEE 2009 IEEE International Reliability Physics Symposium - Montreal, QC, Canada (2009.04.26-2009.04.30)] 2009 IEEE International Reliability Physics Symposium - Process options for improving electromigration performance in 32nm technology and beyond

Aubel, O., Hohage, J., Feustel, F., Hennesthal, C., Mayer, U., Preusse, A., Nopper, M., Lehr, M. U., Boemmels, J., Wehner, S.

Année:

2009

Langue:

english

Fichier:

PDF, 454 KB

english, 2009

5

Comparison of Process Options for Improving Backend-of-Line Reliability in 28 nm Node Technologies and Beyond

Aubel, Oliver, Hennesthal, Christian, Hauschildt, Meike, Poppe, Jens, Hahn, Jens, Boemmels, Juergen, Nopper, Markus, Seidel, Robert

Journal:

Japanese Journal of Applied Physics

Année:

2011

Langue:

english

Fichier:

PDF, 997 KB

english, 2011

6

Membrane-Suspended Nanocompartments Based on Ordered Pores in Alumina

Christian Hennesthal, Janine Drexler, Claudia Steinem

Journal:

Année:

2002

Langue:

english

Fichier:

PDF, 501 KB

english, 2002

7

AIP Conference Proceedings [AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: 11th International Workshop - Bad Schandau, (Germany) (12–14 April 2010)] - Grain Size And Cap Layer Effects On Electromigration Reliability Of Cu Interconnects: Experiments And Simulation

Zhang, Lijuan, Kraatz, Matthias, Aubel, Oliver, Hennesthal, Christian, Zschech, Ehrenfried, Ho, Paul S., Zschech, Ehrenfried, Ogawa, Shinichi, Ho, Paul S.

Année:

2010

Langue:

english

Fichier:

PDF, 3.27 MB

english, 2010

8

[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - Analysis of grain structure by precession electron diffraction and effects on electromigration reliability of Cu interconnects

Cao, L., Ganesh, K. J., Zhang, L., Aubel, O., Hennesthal, C., Zschech, E., Ferreira, P. J., Ho, P. S.

Année:

2012

Langue:

english

Fichier:

PDF, 960 KB

english, 2012

9

Mechanical Properties of Pore-Spanning Lipid Bilayers Probed by Atomic Force Microscopy

Steltenkamp, Siegfried, Müller, Martin Michael, Deserno, Markus, Hennesthal, Christian, Steinem, Claudia, Janshoff, Andreas

Journal:

Biophysical Journal

Année:

2006

Langue:

english

Fichier:

PDF, 427 KB

english, 2006

10

Pore-Spanning Lipid Bilayers Visualized by Scanning Force Microscopy

Hennesthal, Christian, Steinem, Claudia

Journal:

Journal of the American Chemical Society

Année:

2000

Langue:

english

Fichier:

PDF, 89 KB

english, 2000

11

[IEEE 2013 IEEE International Reliability Physics Symposium (IRPS) - Anaheim, CA (2013.4.14-2013.4.18)] 2013 IEEE International Reliability Physics Symposium (IRPS) - An experimental methodology for the in-situ observation of the time-dependent dielectric breakdown mechanism in Copper/low-k on-chip interconnect structures

Kong Boon Yeap,, Gall, M., Sander, C., Niese, S., Zhongquan Liao,, Ritz, Y., Rosenkranz, R., Muhle, U., Gluch, J., Zschech, E., Aubel, O., Beyer, A., Hennesthal, C., Hauschildt, M., Talut, G., Poppe

Année:

2013

Langue:

english

Fichier:

PDF, 607 KB

english, 2013

12

[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnects

Zhang, L., Kraatz, M., Aubel, O., Hennesthal, C., Im, J., Zschech, E., Ho, P. S.

Année:

2010

Langue:

english

Fichier:

PDF, 2.51 MB

english, 2010

13

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Backend-of-line reliability improvement options for 28nm node technologies and beyond

Aubel, O., Hennesthal, C., Hauschildt, M., Beyer, A., Poppe, J., Talut, G., Gall, M., Hahn, J., Boemmels, J., Nopper, M., Seidel, R.

Année:

2011

Langue:

english

Fichier:

PDF, 213 KB

english, 2011

14

[IEEE 2013 IEEE International Reliability Physics Symposium (IRPS) - Anaheim, CA (2013.4.14-2013.4.18)] 2013 IEEE International Reliability Physics Symposium (IRPS) - Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects

Hauschildt, M., Hennesthal, C., Talut, G., Aubel, O., Gall, M., Yeap, K. B., Zschech, E.

Année:

2013

Langue:

english

Fichier:

PDF, 475 KB

english, 2013

15

AIP Conference Proceedings [AIP Publishing LLC PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON MATHEMATICAL SCIENCES - Kuala Lumpur, Malaysia (17–19 December 2013)] - Electromigration void nucleation and growth analysis using large-scale early failure statistics

Hauschildt, M., Gall, M., Hennesthal, C., Talut, G., Aubel, O., Yeap, K. B., Zschech, E.

Année:

2014

Langue:

english

Fichier:

PDF, 1003 KB

english, 2014

16

Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping

Zhang, Lijuan, Ho, Paul S., Aubel, Oliver, Hennesthal, Christian, Zschech, Ehrenfried

Journal:

Journal of Materials Research

Année:

2011

Langue:

english

Fichier:

PDF, 141 KB

english, 2011

17

[IEEE 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Saratoga Springs, NY, USA (2017.5.15-2017.5.18)] 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Measuring the wafer temperature in CVD tools using the wireless SensArray HighTemp-400 wafer

Engelmann, J., Chu, D., Dupraz, T., Haupt, R., Hennesthal, C., Pflug, H., Jaschke, V., Stadel, M.

Année:

2017

Fichier:

PDF, 242 KB

2017